Design, Modeling and Analysis of Cu-Carbon Hybrid Interconnects
نویسندگان
چکیده
In this work, a new interconnect structure is proposed for the first time where copper-carbon nanotube composite encapsulated by graphene barrier layers named here as (Cu-carbon) hybrid interconnects. The motivation behind to utilize enhanced conductivity of (Cu-CNT) and improved reliability copper-graphene (Cu-GNR) in order build better possible replacement copper interconnects near future VLSI applications. steps required fabricate also utilizing fabrication methods Cu-CNT Cu-GNR materials. First-principles-based atomistic simulations suggest that Cu-Carbon more conductive than its parent structures, i.e. hybrid. This deduction supported circuit simulation results at 7 nm node which show experiences least delay among all other alternatives. When compared Cu-GNR, Cu interconnects, 1 mm long lesser ~28%, ~41% ~88%, respectively. Time-domain analysis suggests has steepest sharpest step response. proven be superior alternatives terms signal integrity. Noise-delay-product ~42%, ~47% ~84% Power consumption Power-delay-product reduced ~41%, ~44% ~43% These findings promote candidate
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ژورنال
عنوان ژورنال: IEEE Access
سال: 2021
ISSN: ['2169-3536']
DOI: https://doi.org/10.1109/access.2021.3104299